Samsung announces I-Cube 4 chip embeds logic die and 4-layer HBM

Discussion in 'Frontpage news' started by Hilbert Hagedoorn, May 6, 2021.

  1. Hilbert Hagedoorn

    Hilbert Hagedoorn Don Vito Corleone Staff Member

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  2. tunejunky

    tunejunky Maha Guru

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    in other words, Samsung is following AMD and Intel but is "ARM"-ing up for the next battlefield - high performance ultra-lights.
     

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