Samsung Announces Availability of its Silicon-Proven 3D IC Technology

Discussion in 'Frontpage news' started by Hilbert Hagedoorn, Aug 13, 2020.

  1. Hilbert Hagedoorn

    Hilbert Hagedoorn Don Vito Corleone Staff Member

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    Samsung announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes. Leveraging Samsung's through-silicon via (TSV) technology, X-Cube enables significant leaps in speed and power efficiency to help next-generation applications including 5G, artificial intelligence, high-performance computing, as well as mobile and wearable.

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  2. Kaarme

    Kaarme Ancient Guru

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    Does the technology involve some kind of microscopic heat pipes as well? I always thought stacking the stuff on top of each other would lead to critical problems with heat. Even low-power processors, like those in smartphones, generate more heat than the device can handle, which is indeed a problem with phones. Really low-power stuff in special devices doesn't even need that much processing power or memory to begin with, so I imagine they can be made with any technology no problem.
     
  3. Silva

    Silva Maha Guru

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    @Kaarme
    A modern processor has many sections and components in it's design. It's possible to identify witch produces more heat and place them on the top layer so they can be cooled efficiently.
    Generally speaking I think I/O produces less heat and can be stacked under the work house of the silicon.
     
  4. schmidtbag

    schmidtbag Ancient Guru

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    Hasn't Texas Instruments done this since the Cortex-A8 days? Sure, maybe it didn't pack in as many features, but I thought some of the earlier OMAP CPUs were stacked.
     

  5. JamesSneed

    JamesSneed Maha Guru

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    Yes they call the 3d IC tech "PowerStack" which they started shipping IC's made with PowerStack in 2011.
     
  6. SpajdrEX

    SpajdrEX AMD Vanguard

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