Zen 4 processors will use a land grid array (LGA) socket, according to Twitterer ExecutableFix. Raphael chips would also reportedly have a heat spreader with recesses to accommodate more capacitors.... Renders of AM5 socket for AMD Zen 4 processors
Good luck deliding that What was the plan with this weird shape of IHS? Electrically conductive thermal pastes will kill these CPUs Thanks AMD for not overthinking of those bare components...
I mean, learn to put the conductive paste or use normal one. If you are the level of choosing the best thermal paste, you should have learned how to put it. No?
Such shape may provide better force transfer. I doubt they'd come up with such thing without any reasons. If you're concerned about metal pastes, you may use conformal coating.
Let's hope they will come prepared for that by manufacturer. I can already see nice looking second hand cpus on Ebay, all gaps full of thermal paste...or gaps filled up with silicone sealant
Why would you need to delid it? AMD has been soldering their chips to the IHS for years, somehow I doubt they will stop now. Even Intel has been soldering since the Gen9, but that's just because they needed to get that last couple of Watts of dissipation out of 14nm; they'll probably go back to air gapping as soon as they can to save that $0.001 per unit.
