Scroll down to the Icelake SP lineup. Ice Lake (microprocessor) - Wikipedia In short, their "Glue" seems to be working now. To what I understand, their max core per die is still 28. But they are able to go 4+4, 8+8, 16+16, 20+20, etc. to use their manufacturing process and imperfect dies more efficiently, and not rely just on perfect dies for high core count. This provides them with advantages similar to chiplets from AMD, but still not at the same level of modularity and scale-in capability. However, it does help them reduce the cost to manufacture significantly (as expected), which is evident in the competitive pricing structure, and bin for a better product stack. Additionally, their chiplet sizes are still huge, but not as big as 14nm+++++, because they are on 10nm now. I am still not sure how this will play into desktop market. Lets see if they are able to do the same for smaller chiplets or not, as their "glue" is a bit more expensive than the one used by AMD, but it may trickle down in later generations. I hope this helps bring some discussion points forward, have at at it.