Think of a chip designed as a layer cake (a 1-millimeter-thick layer cake) versus a chip with a more-traditional pancake-like design. Intel's Foveros advanced packaging technology allows Intel to &q... Intel Talks "Lakefield" Foveros Package
It does sound very useful for low-power chips for small devices, be they embedded or handheld. For high-power chips I'm sure the cooling will be a challenge without Intel's favourite ozone layer destroying industial cooler solutions.
Intel's Embedded Multi-die Interconnect Bridge (EMIB) will be part of Foveros chips. What that means for high power chips Intel will be going to chiplets to add more cores much like AMD does versus many layers of stacking. So they can go vertical or with chiplets horizontal. Intel's approach is more elegant than AMD but it is verification AMD's glue was the right direction.
