Intel Talks "Lakefield" Foveros Package

Discussion in 'Frontpage news' started by Hilbert Hagedoorn, Feb 12, 2020.

  1. Hilbert Hagedoorn

    Hilbert Hagedoorn Don Vito Corleone Staff Member

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    Think of a chip designed as a layer cake (a 1-millimeter-thick layer cake) versus a chip with a more-traditional pancake-like design. Intel's Foveros advanced packaging technology allows Intel to &q...

    Intel Talks "Lakefield" Foveros Package
     
  2. Kaarme

    Kaarme Ancient Guru

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    It does sound very useful for low-power chips for small devices, be they embedded or handheld. For high-power chips I'm sure the cooling will be a challenge without Intel's favourite ozone layer destroying industial cooler solutions.
     
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  3. JamesSneed

    JamesSneed Maha Guru

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    Intel's Embedded Multi-die Interconnect Bridge (EMIB) will be part of Foveros chips. What that means for high power chips Intel will be going to chiplets to add more cores much like AMD does versus many layers of stacking. So they can go vertical or with chiplets horizontal. Intel's approach is more elegant than AMD but it is verification AMD's glue was the right direction.
     
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  4. schmidtbag

    schmidtbag Ancient Guru

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    So it should be called Cakefield!
     
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  5. Zeka

    Zeka Active Member

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    Excellent opportunity to introduce a new socket, Intel is playing all the old hits.
     

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