Intel shows first fully patterned 450mm wafer

Discussion in 'Frontpage news' started by Hilbert Hagedoorn, Jan 22, 2013.

  1. Hilbert Hagedoorn

    Hilbert Hagedoorn Don Vito Corleone Staff Member

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    Intel presented world's first fully patterned 450mm wafer at last week's SEMI Industry Strategy Symposium. No further details were shared by Intel at the event but previous reports indicate the chip...

    Intel shows first fully patterned 450mm wafer
     
  2. War child

    War child Master Guru

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    Anyone else notice the reflection on the wafer is a resemblance to Alfred Hitchcock :eyes:
     
  3. chilly willy

    chilly willy Master Guru

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    Is that big chunk supposed to be gone?
     
  4. Tripkebab

    Tripkebab Member Guru

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    Your gonna need a monster sized case to fit that in! *drumrole*
     

  5. Belz

    Belz Master Guru

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    That's the reflection of a face you're looking at
     
  6. Denial

    Denial Ancient Guru

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    [​IMG]
     
  7. tsunami231

    tsunami231 Ancient Guru

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    i dont get it 450mm what so special about this?
     
  8. HeavyHemi

    HeavyHemi Ancient Guru

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    Beyond the size? It's actually quite a feat to maintain mask alignment at the feature sizes they are using now over a wafer that large. From Semi.org: 450mm fab with a capacity of 40-45k wafer starts per month can produce the same volume of die as a 300mm fab with 100k wafer starts per month
     
  9. chilly willy

    chilly willy Master Guru

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    Ha nice, it looked like a chunk was missing
     
  10. tsunami231

    tsunami231 Ancient Guru

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    ok...
     

  11. WinMacLin

    WinMacLin Member Guru

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    This means Intel can a little more than double their chip production within the same amount of factory space.

    Main benefits:
    Can build fewer new factories which cost billions of dollars to setup
    Can increase profit per employee ratio
    Can produce more processors to meet demand
    Faster launches of newer architectures due to higher yields*
    Reduced cost in manufacturing, perhaps more competitive pricing for consumer

    *With this one I should explain that when Intel or any chip maker for that matter starts offering a new architecture that they've never built before there are often issues and many of the chips they make (A wafer like pictured in the article can hold hundreds of processors) will not work correctly. By increasing the size of the wafers they will also increase the amount of working processor dies and be able to shorten their initial architecture launch windows.

    Basically even with damaged dies these new wafers would allow them to have the same volume of working dies that they have now from the previous 300mm wafers on a well established architecture right at the beginning of a new architecture that is fraught with defects.
     
  12. (.)(.)

    (.)(.) Banned

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    This was very informative WinMacLin, thank you for explaining.:)
     
  13. SLI-756

    SLI-756 Banned

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    hehe
     

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