This week at SEMICON West in San Francisco, Intel engineering leaders provided an update on Intel's advanced packaging capabilities and unveiled new building blocks, including innovative uses of EMIB... Intel Offers New Tools in Its Advanced Chip Packaging Toolbox
Leader uses them 1st and have them best. Intel at best managed to put AMD's Vega on same interposer as intel's CPU, lately. They used to have MCM. But till recently they did not really felt need to use it. Except they felt the need to mock others who did use it before them. Who did used other methods to which intel had to catch up (understandably). eDRAM was really big success. While Micron used Package on Package. There are many different applications to different approaches and none are wrong. But someone who mocks rest of industry for something and then calls himself a leader of given thing... "Blue Leadership" => "Glue Leadership"
They went through all this effort to make up their own lingo and unnecessary acronyms to make it sound different from what AMD is doing, and yet... they used the word "chiplet". Sure, it isn't trademarked, but at this rate it's a word very much associated with AMD (in this context). If they went this far to try to distinguish themselves, why'd they stop there? No of course not! This isn't mere GLUE, it's Foveros, and EMIB! Jeez... aren't the differences obvious!?
It was what Intel have done and AMD was laughing at, years before your point... endless story, same with copro/CPU core and CPU with 3rd part on die (but ARM is better on that point)...
Reminds me of Star Trek We've been attempting to re-align the quantum isotronic stabilizers, but we're getting interference from the tachyon field generator preventing a stable warp matrix.
