Intel Embedded Multi-Die Interconnect Bridge - EMIB

Discussion in 'Frontpage news' started by Hilbert Hagedoorn, Nov 27, 2019.

  1. Hilbert Hagedoorn

    Hilbert Hagedoorn Don Vito Corleone Staff Member

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    Most chips in today’s smartphones, computers and servers are comprised of multiple smaller chips invisibly sealed inside one rectangular package. How do these multiple chips — often including CPU,...

    Intel Embedded Multi-Die Interconnect Bridge - EMIB
     
  2. Kaarme

    Kaarme Ancient Guru

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    Previously, Intel only experimented with the rice grain, but couldn't make chiplets communicate with each other through the piece of cereal. Thus, we were stuck with four cores max, in mainstream, for years. Only recently, inspired by AMD, Intel realised a rice grain won't work and came up with this silicon solution.
     
  3. icedman

    icedman Maha Guru

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    ^haha it's sad but that's what it seems like.
    It's good to finally see better pricing and some actual advancement from intel again tho, my last 3 systems I've built for my house hold have all been AMD and if intel doesnt bring anything soon the next will also be AMD they just have the price to performance victory here
     
  4. Kaotik

    Kaotik Member Guru

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    Fun fact: Kaby Lake-G with AMD Radeon graphics was the first or one of the first products to use EMIB (can't remember whether Stratix 10 FPGA got out before or after)
     

  5. Venix

    Venix Ancient Guru

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    That's some fancy glue intel made there !
     

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