Fine Utilise Power of RadeonPRO Software & SweetFX

Discussion in 'Videocards - AMD Radeon' started by OnnA, Apr 17, 2015.

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  1. OnnA

    OnnA Ancient Guru

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    Assassin Creed Unity Tweaks

    Here some of my Tweaks for AC:Unity (works great and Performance is Great)


    First for Radeon users -> Run RadeonPRO with Admin and AC:U also change to run as admin (for Stability, no crashes or bugs)
    Set for LCD dynamic framerate control to eg. 60Hz/120Hz/144Hz how much your LCD can. +2 so it will be 62/122/146 -> Untick Vsync in AC:U
    Next set your SweetFX etc.

    As for nV players do the same in nV CP -> set desired LCD refresh=FPS +2 and its done.

    Due to very hot summer, i have my XFX on 1050/1550 1.143v +8%POW (60-62 degrees celsius after 5-8h !)
    My settings when playing AC:U -> Res: 1792:1344 85Hz All Ultra High with HBAO+ but Shadows is Low (max recomended is Medium) and Details are on Very High (also recomended)
    Disable AA in Game and Use SMAA inject in RP (my SMAA is in the screenshot of RP below)
    Also for some FPS gain make it use x32 or x48 tesselation instead x64/x128

    Also some of the screens are taken when i'm playing with Options and AA SMAA in RP ;-)
    the Last one's is from my current build.

    GREAT Game BTW :banana:

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    last ones

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    Last edited: Aug 10, 2015
  2. PrMinisterGR

    PrMinisterGR Ancient Guru

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    What's your texture resolution in AC Unity?
     
  3. OnnA

    OnnA Ancient Guru

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    Ok here ->

    Env. Detail - Very High
    Textures -> Ultra High
    Shadows -> Low
    AO -> HBAO+
    Bloom On
    AA in Game OFF / V-sync OFF (in CAT FPS set to 65)
    In Options (.ini file) Detailed Teeselation=1 (that's cool but for this i give tes. x32 in CAT ;-)
    SweetFX in RP is ON and SMAA custom = 0.8/12/6/0 (less jiggles)
    OMG that Game is HEAVY -> 6.7GB in RAM !

    More Screens (final build yet sometimes ~33FPS can occur its OK BTW ;-)

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    Last edited: Aug 10, 2015
  4. SpajdrEX

    SpajdrEX AMD Vanguard

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  5. PrMinisterGR

    PrMinisterGR Ancient Guru

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    I haven't backed the game, but considering how much feedback and progress updates they give every single week, I believe it will be published for sure. That's a nice circlejerk about Star Citizen, but it's starting to get annoying. It is basically a gradually funded AAA title, and people expect it to be ready in a couple of years.
     
  6. OnnA

    OnnA Ancient Guru

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    On screen 4 (the Roof-top) actually you can see advanced tesselation in full spectrum.
    Look on this details on the roof and walls :)
    And 3-rd scrren counting from the bottom (the wall and street from roof)
     
    Last edited: Aug 10, 2015
  7. OnnA

    OnnA Ancient Guru

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    Nex I will give Tweaks for AC:U -> will be just below main post (i've just reserved space now)
     
  8. PrMinisterGR

    PrMinisterGR Ancient Guru

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    There is no tessellation patch out.

    Look here, it is quite obvious that there is nothing like that.
     
  9. OnnA

    OnnA Ancient Guru

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    Hmm they removed it from game?
    BTW that screen showing only HBAO+ :D Turn OFF ON in game and you'll see :)

    Here -> https://www.youtube.com/watch?v=qzS3EzOIs1A

    BTW i'm building now Tweaks and Tips for AC:U in 3rd Post
     
    Last edited: Aug 13, 2015
  10. OnnA

    OnnA Ancient Guru

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  11. OnnA

    OnnA Ancient Guru

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    New Tweaks on Main Pg.
     
  12. PieEyedPiper

    PieEyedPiper Master Guru

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    Couple of errors on first page. "sc" attached to the line above it, etc.

    Thanks for your contributions!
     
  13. OnnA

    OnnA Ancient Guru

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    THX
    it need to be corrected, so tell me exacly where?
    Greets
     
  14. OnnA

    OnnA Ancient Guru

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    New Update to Win_X Telemetry Disabling :D
    Have Fun
     
  15. OnnA

    OnnA Ancient Guru

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    News

    AMD readies three new GPUs: Greenland R490, Baffin R480 and Ellesmere R470 (? i think for sure)

    In the recent years, Advanced Micro Devices has reduced the amount of new graphics processors it releases per annum, which lead to massive erosion of its market share and revenue. While the company hopes that its latest product lineup will help it to regain some of the lost share and improve earnings, the firm pins considerably more hopes on an all-new family of products that will be released in 2016.

    AMD’s code-named “Arctic Islands” family of products will include three brand-new chips – “Greenland”, “Baffin” and “Ellesmere” – a source with knowledge of AMD plans said. The “Greenland” will be the new flagship offering for performance enthusiasts, whereas the “Baffin” and “Ellesmere” will target other market segments, such as high-end and mainstream. It is unclear whether the “Arctic Islands” family will take in any existing products, but it is possible that AMD may address certain markets with previous-gen products.

    “Greenland” will be AMD’s first graphics processing unit based on the all-new micro-architecture, which development began a little more than two years ago. While the architecture is currently known as another iteration of GCN, the new ISA [instruction set architecture] will be so considerably different compared to the existing GCN that it has every right to be called “post-GCN”, the source said. It is likely that the “Greenland” will retain layout of the contemporary AMD Radeon graphics processing units, but there will be significant changes in on the deeper level.

    The only official thing currently known about the new architecture, which Mark Papermaster, chief technology officer of AMD, calls the next iteration of GCN, is that it is projected to be two times more energy efficient compared to the current GCN. Essentially, this means means major performance enhancements on the ISA level. Thanks to the fact that the “Greenland” graphics processing unit will be made using either 14nm or 16nm FinFET process technology, expect it to feature considerably larger number of stream processors than “Fiji”.

    The “Greenland” graphics processor will rely on the second-generation high-bandwidth memory (HBM), so expect ultra-high-end graphics cards and professional solutions with up to 32GB of DRAM onboard with bandwidth of up to 1TB/s. Consumer-class “Greenland”-based products will likely come with 8GB – 16GB of memory. Due to usage of HBM, expect the “Greenland” chip and upcoming graphics cards on its base to resemble the currently available AMD Radeon R9 Fury-series adapters.

    The number of transistors inside the “Greenland” as well as its die size are unknown. Since 14nm/16nm FinFET manufacturing technologies have considerably (up to 90 per cent) higher transistor density than contemporary TSMC’s 28nm fabrication process, it is logical to expect that the new flagship product will feature 15 – 18 billion of elements if it retains around 600mm² die size from the “Fiji”.

    Read More -> http://www.kitguru.net/components/g...gpus-for-2016-greenland-baffin-and-ellesmere/
     
    Last edited: Aug 21, 2015

  16. OnnA

    OnnA Ancient Guru

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    News 2

    Physically-based & Unified Volumetric Rendering in Frostbite

    Talk by Sebastien Hillaire at SIGGRAPH 2015 in the Advances in Real-time Rendering course.

    Rendering convincing participating media for real time applications, e.g. games, has always been a difficult problem. Particles are often used as a fast approximation for local effects such as dust behind cars or explosions. Additionally, large scale participating media such as depth fog are usually achieved with simple post-process techniques. It is difficult to have all these elements efficiently interacting with each other according to the lights in the scene.

    The authors propose a way to unify these different volumetric representations using physically based parameters: a cascaded volume representing extinction, voxelization method to project particles into that extinction volume, a simple volumetric shadow map that can then be used to cast shadow from any light, according to every volumetric element in the scene, and finally a solution to render the final participating media.

    The presented set of techniques and optimizations form the physically based volumetric rendering framework that will be used for all games powered by Frostbite in the future.

    Here Slides and Videos from SIGGRAPH 2015 -> http://www.frostbite.com/2015/08/physically-based-unified-volumetric-rendering-in-frostbite/

    And latest Gameplays from early build of New NFS 15 ( Reboot )

    -> https://www.youtube.com/watch?v=Rep1X-pFX1U&list=PLWsQtN4VBZj6IRG7x1HwI83c7E4_kutzS&index=9

    Some of my Screens (NFS 15)

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  17. OnnA

    OnnA Ancient Guru

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  18. OnnA

    OnnA Ancient Guru

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    New Tweak Associated with Telemetry Net Usage :D
    24/VIII
     
  19. OnnA

    OnnA Ancient Guru

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    New Updated Tweak for Telemetry
    High PING Gain !!
    And don't worry MS don't collect your Priv. Data :D
    So much Hate -> All the Telemetry is for one thing ! -> Non Power Users will have Stable/Reliable System w/o Crashes etc.
    With New Updated WHQL Drivers from H/W manufacturers. OMG that was simple
     
  20. OnnA

    OnnA Ancient Guru

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    AMD Showcases Graphics, Energy Efficient Computing and Die-Stacking Innovation

    AMD Showcases Graphics, Energy Efficient Computing and Die-Stacking Innovation

    Top technologists from AMD are detailing the engineering accomplishments behind the performance and energy efficiency of the new high-performance Accelerated Processing Unit (APU), codenamed "Carrizo," and the new AMD Radeon R9 Fury family of GPUs, codenamed "Fiji," at the prestigious annual Hot Chips symposium starting today. The presentations will focus on new details of the high-definition video and graphics processing engines on the 6th Generation AMD A-Series APU ("Carrizo"), and the eight year journey leading to die-stacking technology and all-new memory architecture included on the latest top-of-the-line AMD Radeon Fury Series GPUs ("Fiji") for 4K gaming and VR. Using a true System-on-Chip (SoC) design, 6th Generation AMD A-Series processors are designed to reduce the power consumed by the x86 cores alone by 40 percent, while providing substantial gains in CPU, graphics, and multimedia performance versus the prior generation APU. The new AMD Radeon R9 Fury X GPU achieves up to 1.5x the performance-per-watt of the previous high-end GPU from AMD.

    "With our new generation of APU and GPU technology, our engineering teams left no stone unturned for performance and energy efficiency," said Mark Papermaster, chief technology officer at AMD. "Using innovative design for our APUs, we've vastly increased the number of transistors on-chip to increase functionality and performance, implemented advanced power management, and completed the hardware implementation of Heterogeneous System Architecture. For our latest GPUs, AMD is the first to introduce breakthrough technology in the form of die-stacking and High-Bandwidth Memory. The results are great products with very large generational performance-per-watt gains."

    The details will be shared in two symposium presentations. On August 24, Guhan Krishnan, AMD fellow, design engineering, will present "Energy efficiency in graphics and multimedia in 28nm 'Carrizo' APU." This session will provide an in-depth view of the multitude of advancements resulting in superior performance, battery life, and user experiences on performance notebook and convertible form factors. In "AMD's next Generation GPU and memory architecture" on August 25, Joe Macri, corporate vice president and product chief technology officer at AMD, will share the journey from inception to market that covered eight years and involved several key partners, as well as provide architectural details behind the performance and efficiency of the new AMD Radeon R9 Fury line of GPUs.

    Die-Stacking Journey Culminates In High-End GPU
    The path to the new "Fiji" family of AMD Radeon R9 Fury GPUs began with exploring the best die-stacking option for bringing large amounts of memory into the same chip package with the GPU while dramatically increasing the memory bandwidth available to a high-performance graphics engine, without increasing power consumption. Working with memory partner SK Hynix, the new GPUs based on AMD Graphics Core Next (GCN) architecture offer up to 4 GB of high-bandwidth memory (HBM) over a 4096-bit interface to achieve an unprecedented 512 Gb/s memory bandwidth. The new memory is stacked close to the GPU in the package by implementing the first high-volume interposer as well as the first through-silicon vias (TSVs) and micro-bumps in the graphics industry. HBM and the interposer provide 60 percent more bandwidth than previous generation GDDR5 memory3 and 4x the performance-per-watt of GDDR5.4 At the same time, the "Fiji" family is capable of up to 8.6 TFLOPS performance, a nearly 35 percent increase over the previous generation (Radeon R9 290 Series GPUs).The result is an improvement of up to 1.5x performance-per-watt.

    From -> http://www.techpowerup.com/215496/a...nt-computing-and-die-stacking-innovation.html
     
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