Just look at this. Not once piece of hardware above 30C. Hottest piece of hardware is the HDD's as they are inside a Define S case and are mounted around the back of the mobo tray so not much airflow but still nothing to worry about. AMD's decision to use solder has paid off massively. my 1800x is overclocked to 4.1GHz @ 1.45vcore 1.15vSOC with 3200MHz CL14 RAM. GPU is cooled by a H90 AIO using Kraken G12 bracket. Fans are running at a locked 1200rpm on my H115i (replaced stock fans with noctua 140s). Front intake fans are at 1400rpm (EKWB Vardar 120s x3). H90 fan is running at 900rpm as outtake (using stock fractal 140 fan in case). H115i pump is running at balanced around 1500rpm-2000rpm (max is 3k). Room temp is around 18-20C. The system is audible, I can drop all fans down to 900rpm and temps only rise around 5C on the main components. Load temps after 6hrs of OCCT linpack x64 all cores AVX enabled never exceed 62C on the CPU. My i7700K that I delid and used liquid metal on would run around 80-85C sure it was running at 4.9GHz but it only used 1.38V and is 4 cores 8 threads. Ryzen is double the cores, double the threads, still runs at a decent 4.1GHz across all cores but needs a lot more volts 1.45V (LLC brings it down to 1.42V). Honestly I can not wait for AMD to release Zen 2 and 3 hopefully they bring improved IPC but more importantly I want them to bring higher clocks speeds. If Zen 2 can reach 4.5GHz across all 16 threads and stay below 70C I will be amazed. End of fanboy post
Sweet Me to. I seem to remember reading that AMD themselves are expecting a 10% IPC improvement, not sure if higher clocks are part of this speed improvement or not though....