AMD this week launched their Ryzen 2000G series of APUs. Guru3D yesterday already reported that the APUs have thermal paste in-between the die and heatspreader, opposed to being soldered. It's four c... AMD Ryzen 5 2400G gets delidded and temperature tested
still MILES ahead of what....you know who does what with their bird poop. Good job AMD. looking forward to Ryzen +, i want to upgrade my haswell (which goes to thermal throttling regardless of which cooler i use)
So, the amd jumped into the wagon of those who eat...you know what....AMD has chosen to "follow the leader"? Nice, and one reason less for me to take amd into consideration for my next upgrade.
What does it matter with these APUs? They are meant for HTPCs, office machines, and for those who desperately need to save every penny. There's little point in overclocking them (just buy a real CPU if you need power) and the default temps aren't disastrous. You shouldn't "upgrade" your current 4 cores CPU to another 4 cores CPU (even though Intel would have had you believe otherwise for multiple generations straight). We already know the real deal, Ryzen 2.0, will have soldered heatspreaders just like the first Ryzen. If you really were considering AMD as an option, that's where you'd be looking. But of course if you were already set on getting Intel in any case, naturally no fact would change your opinion.
AMD's APUs have used paste before. These chips are meant to be budget chips with low wattage (65W) so using paste is acceptable. Their high-end chips still use solder, like they should.
Can we get the Room temperature stated? i live in California it can hit 120 degrees Fahrenheit here; id like to see how a processor handles a high heat environment as well. Anyway, i thank the dude for taking the time to inform us we can delid and get some improvement off this apu.
Exactly. I managed to get full 2200G build with 2x4GB RAM + 128GB SSD + 2TB HDD ... for my cousin under 400 Euro including tax. Secondly, as has been stated, delidding did not really improve OC. So what would be temparature of unmodified APU, just undervolted a bit? Compared to delided one, it is likely to make delidding pointless. And I do disagree with guys statement about small cases benefiting more. Quite contrary, 3 liter case can exchange air more efficiently than 30 liters.
I reckon that's usually connected to avoiding fan noise. A very compact case would only have room for a smaller, higher RPM, noisy fan. One of those roughly cube shaped cases that would have room for at least a 12cm fan would solve that.
AMD went for cheaper material and costs for their lower end lower price lower markup parts and you somehow seem to think that AMD is "following the leader", of whom put lower end material on higher end, high cost parts? Illogical much?
Cant tell if you are being sarcastic, or you are just a, you know.. what Red Foreman calls his dear son. Anywho, AMD didn't beat around the bush like the "leader", they said that these APUs are for budget market, and they wanted to reduce cost by using TIM. All non-APU chips will still be soldered.
This makes a lot of sense now as to why i could never keep my a10 5800k cooled properly now. I just learned from der8aur that all the way back to Trininty wasn't soldered.
