If the estimates are right, AMD will release the optimized v2.0 of Ryzen (Pinnacle Ridge) processors in April alongside the new X470 chipset. It has now been confirmed that these 2nd gen processors wi... Upcoming Ryzen 2.0 (Pinnacle Ridge) Will Get Soldered Heatspreader
I was going to get a 6c/12t ryzen+ but now i'm even more excited. Can't wait, it will be a day one buy for me.
The TIM on Raven Ridge was only to save on cost, as the 2200G and 2400G are budget parts and only rated for 65W. For their high-end parts, they will continue to user solder, which is pretty much what was expected - those paying the premium for these chips deserve the best cooling option.
Yep, from what I've read it's only Intel using paste on their cpus, unless they've changed that in response to AMD going solder with Ryzen cpus. (2xxx G's are APUs, not technically cpus...)
I doubt Intel will ever change on that. As long as their customers are willing to put up with the TIM (and delidding) then they'll continue using it. People vote with their wallets, and every time an Intel CPU (that uses TIM) is sold Intel receives a signal that TIM is acceptable, so why change?
Don't bet on it. I predict PCI slots will pretty much be completely phased out in 2-3 years. If you need it that badly, might think about getting something like this: https://www.alibaba.com/product-detail/Mini-PCIe-to-2-external-pci_1890717704.html Though obviously that ends up taking more room and i can only assume you want to take up less room since you want mATX
I have PCIe to PCI convertors in mind as last resort. There are cheaper versions for mounting into case. But it is for Soundcard. I did not evade STX with PCIe2PCI bridge on board (reducing sound quality) just to have it on standalone PCIe2PCI bridge. In that case I can just pay whole price for STU (New USB version).
Nothing really new, just as expected, at least to me. Another great option is coming in april. It's good for everybody.
That roadmap pic is bugging me. "Zen 2 Improves on zen in multiple dimensions" Does this mean that we will need new socket because dimensions will be bigger/smaller or CPUs will get improvements in some AMD dimensions only (which does not include dimension where we live)?!
And Skylake-X and Kabylake-X both use TIM, not solder. Those paying the premium for these chips deserve the best but Intel is not giving it to them.