AS5 line method is what I use. The compound doesn't need to completely cover the IHS (integrated heat spreader) as the CPU cores are located directly below the center of the spreader. Here is an interesting video: http://www.youtube.com/watch?feature=player_detailpage&v=EyXLu1Ms-q4&list=PLBAF48E797A43FBE5
Just went from "pea-sized blob" method (which made a nice circle of paste) to "credit-card-spread-layer" method on my NH-D14, it's shaved 8 degrees of ALL my temperatures = more OCing headroom . Compound is Arctic MX-3. One of my cores still runs 12 degrees hotter than the coldest, however, so I'm putting that down the CPU rather than my cooler/application method.
I apply a small line across the edge of tge coolers base and use a straight razor to spread evenly across, its very thin when i finish.
You can buy ceramic based paste that is non conductive. Working well using the thin layer method. Arctic sells some.
yeah well....its the cooler..hehe..i have the exact same cooler here..OCZ Vendetta 2...its not really the best surface and not so glossy and shiney... but my temps are good doh...
I disagree with the adage "you don't need to fill the entire area" because the heatsink will supposedly push and spread it out when tightened down. It will do this a little but not across the entire chipset, and there is no way to know that it is doing a proper job because we cannot see it. I use a line and spread it thinly and evenly across the entire chip, filling in any blanks that are missed. That way I know all bases are covered.
^ This..... This is true... Not all thermal pastes are conductive. Silver, Copper and Aluminum based thermal pastes typically are. Arctic Cooling and Tuniq's thermal pastes, as well as Arctic Silver Ceramique are none conductive. Silicone based thermal pastes are also non-conductive. Also, there's no need at all to cover the entire processor IHS surface. If you look at the stock Intel coolers, they only cover the center section of the IHS. This is all that's actually necessary as the center of the IHS is the hottest part of the processor....as well as being the most critical to remove heat from.
I only apply the paste to the smallest surface. If HSF plate is smaller than the CPU, I only apply paste to the whole HSF. (3930k) If CPU is smaller than HSF plate, I apply paste to the full cpu plate. (2600k) Always apply full paste because it's more effective in heat transfer than leaving holes in paste.
Doesnt need to cover the whole base? Then there isnt optimum cooling... lol. A Small dot covers a circular pattern, and a cpu has its cores near the corners of the chip.
The CPU isn't the size of the entire grid array. It's a small square in the center. http://www.bench mark reviews .com/images/reviews/processor/i7-2600K/intel_core_i7_2600K_transparent.jpg SB cpu with heat spreader removed : -scheherazade
Thank you, and exactly the reason the "drop in the middle" isn't efficient. Even spread over the chip folks! Think of it as making a peanut butter and jelly. Do you put a blotch of peanut butter in the middle, press the bread together and hope it will mash it evenly over the whole sandwich? no? exactly.
Have always used the Rice/BB in middle method, let the heatsink do the work of spreading and I've never had any problems & nice low temps.
